IMARC Group, a leading market research company, has recently released report titled, “ Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028 “ The study provides a detailed analysis of the industry, including the global wafer level packaging market growth, share, size and growth forecasts. The report also includes competitor and regional analysis and highlights the latest advancements in the market.

Report Highlights:

How big is the wafer level packaging market?

What is wafer level packaging?

Wafer level packaging (WLP) is a technique that involves attaching packaging components to integrated circuits (ICs) while they are still part of a wafer, before separating them into individual circuits. This process offers various benefits such as cost and time savings in electrical testing, as the connections are accessible on the wafer. Additionally, WLP helps reduce chip size, enables traceability, and facilitates inventory management. It is widely applied in several industries including aerospace, defense, electronics, information technology (IT) and telecommunication, healthcare, and automotive sectors worldwide.

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What are the growth prospects and trends in the wafer level packaging industry?

The demand for circuit miniaturization is being accelerated by the increasing adoption of high-speed and compact electronic devices. This trend currently stands as a major factor driving the market on a global scale. Furthermore, the thriving electronics industry and the widespread use of semiconductor integrated circuits (ICs) in the Internet of Things (IoT) are contributing to market growth. Additionally, the growing environmental concerns and the rising popularity of electric vehicles (EVs) are presenting lucrative opportunities for key market players to introduce automotive electronic components used in infotainment systems, powertrain control, communication, and driver assistance systems worldwide. Moreover,

What is included in market segmentation?

The report has segmented the market into the following categories:

Breakup by Packaging Technology:

• 3D TSV WLP
• 5D TSV WLP
• WLCSP
• Nano WLP
• Others

Breakup by End Use Industry:

• Aerospace and Defense
• Consumer Electronics
• IT & Telecommunication
• Healthcare
• Automotive
• Others

Breakup by Region:

• North America
• Asia-Pacific
• Europe
• Latin America
• Middle East and Africa

Who are the key players operating in the industry?

The report covers the major market players including:

• Amkor Technology Inc.
• China Wafer Level CSP Co. Ltd.
• Chipbond Technology Corporation
• Deca Technologies Inc. (Infineon Technologies AG)
• Fujitsu Limited
• IQE PLC
• JCET Group Co. Ltd.
• Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
• Tokyo Electron Ltd.
• Toshiba Corporation.

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