DIP (DIP package) is the full name of DUAL IN-LINE PACKAGE "Dual in-line packaging technology", one of the simplest packaging methods, refers to the use of dual in-line packaging integrated circuit chips, most small and medium-sized integrated circuits are In this package form, the number of pins generally does not exceed 100. The DIP packaged CPU chip has two rows of pins, which need to be inserted into the chip socket with the DIP structure.

DIP package structure forms include multilayer ceramic dual in-line DIP, single-layer ceramic dual in-line DIP, lead frame DIP (including glass ceramic sealing type, plastic encapsulation structure type, ceramic low-melting glass encapsulation type) Wait.

Suitable for perforation welding on PCB, easy to operate. The ratio between the chip area and the package area is larger, so the volume is also larger. The earliest CPUs such as 4004, 8008, 8086, and 8088 all used DIP packages, and the two rows of pins on them could be inserted into slots on the motherboard or soldered on the motherboard.

SMT PCB stands for "Surface Mount Technology" (Surface Mount Technology), one of the most popular technologies and processes in the electronics assembly industry. It is a kind of surface mount components (SMC/SMD for short, chip components in Chinese) that are packaged in a matrix arrangement without leads or short leads or balls, and are mounted on the surface of a printed circuit board or other substrates. Circuit assembly technology in which reflow soldering or dip soldering is used for soldering and assembly.

SMT patch is generally mounted with no-lead or short-lead surface assembly components. It is necessary to print solder paste on the circuit board, then mount it through a placement machine, and then fix the device through reflow soldering. The DIP welding is a direct-insertion packaged device, which is fixed by wave soldering or manual soldering.

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