The global Integrated Passive Devices market was valued at USD 1.88 billion in 2022 and expected to grow at a CAGR of 11.6% during the forecast period.
Integrated Passive Devices (IPDs) are a type of electronic component that integrate passive components, such as resistors, capacitors, and inductors, into a single chip. Unlike traditional passive components that are physically separate from other components, IPDs combine multiple components onto a single substrate, providing benefits such as reduced size, improved reliability, and reduced parasitic effects. IPDs are typically fabricated using thin-film or thick-film processes on a ceramic, glass, or silicon substrate. Thin-film processes involve depositing thin layers of metal or dielectric material onto the substrate, while thick-film processes involve printing layers of conductive and dielectric inks onto the substrate. IPDs are commonly used in RF (radio frequency) and wireless communication applications, such as cellular phones, wireless LANs, and Bluetooth devices. They can also be found in other applications such as power management, sensors, and medical devices. The advantages of IPDs include higher component density, improved signal integrity, and lower parasitic effects. However, they can be more expensive than discrete passive components, and their performance may be limited by the materials and processes used in their fabrication.
https://analyticsmarketresearch.com/reports/integrated-passive-devices-market/52082/ The global Integrated Passive Devices market was valued at USD 1.88 billion in 2022 and expected to grow at a CAGR of 11.6% during the forecast period.
Integrated Passive Devices (IPDs) are a type of electronic component that integrate passive components, such as resistors, capacitors, and inductors, into a single chip. Unlike traditional passive components that are physically separate from other components, IPDs combine multiple components onto a single substrate, providing benefits such as reduced size, improved reliability, and reduced parasitic effects. IPDs are typically fabricated using thin-film or thick-film processes on a ceramic, glass, or silicon substrate. Thin-film processes involve depositing thin layers of metal or dielectric material onto the substrate, while thick-film processes involve printing layers of conductive and dielectric inks onto the substrate. IPDs are commonly used in RF (radio frequency) and wireless communication applications, such as cellular phones, wireless LANs, and Bluetooth devices. They can also be found in other applications such as power management, sensors, and medical devices. The advantages of IPDs include higher component density, improved signal integrity, and lower parasitic effects. However, they can be more expensive than discrete passive components, and their performance may be limited by the materials and processes used in their fabrication.
https://analyticsmarketresearch.com/reports/integrated-passive-devices-market/52082/
Arabic
French
Spanish
Portuguese
Deutsch
Turkish
Dutch
Italiano
Russian
Romaian
Portuguese (Brazil)
Greek